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Manufactures precision dicing and grinding equipment essential for semiconductor wafer processing in AI chip production.
Snapshot
| Country |
JPN
|
| Exchange | Tokyo |
| AI Layer |
chips
|
| Category |
2.50 Semiconductor Capital Equipment & EDA
|
| Sentiment |
72.0% |
| USD Mkt Cap | 36.67B |
| USD Revenue | 3.00B |
| USD Net Income | 949.37M |
| P/E | 41.67 |
| fwd P/E | 38.19 |
| PEG | 1.60 |
| Price 3M | -35.5% |
| Price 6M | -25.5% |
| Price 1Y | +26.5% |
| Price 2Y | +49.0% |
| USD Share Price | 335.26 |
Price & Size
| Price |
51,980.00 JPY |
| Market Cap |
5.64T JPY |
| Shares Outstanding |
108.47M |
| Shares Float |
87.37M |
| 52w Low |
42,370.00 JPY |
| 52w High |
91,680.00 JPY |
| Avg Volume |
1.72M |
Valuation
| P/E (trailing) |
41.7x |
| P/E (forward) |
38.2x |
| P/B |
9.68x |
| Enterprise Value |
5.35T JPY |
| Book Value / Share |
5,367.21 JPY |
| PEG Ratio |
1.60x |
| P/S |
12.22x |
| EV / Revenue |
11.61x |
| EV / EBITDA |
25.02x |
Income
| Revenue |
461.28B JPY |
| Revenue / Share |
4,253.66 JPY |
| EBITDA |
214.05B JPY |
| Net Income |
145.98B JPY |
| EPS (trailing) |
1,247.52 JPY |
| EPS (forward) |
1,360.94 JPY |
Margins & Profitability
| Gross Margin |
70.8% |
| Operating Margin |
42.7% |
| Profit Margin |
31.6% |
| EBITDA Margin |
46.4% |
| Return on Equity |
27.4% |
| Return on Assets |
18.1% |
Growth
| Revenue Growth |
27.1% |
| Earnings Growth |
43.5% |
Cash & Debt
| Total Cash |
283.89B JPY |
| Total Debt |
0 JPY |
| Current Ratio |
3.00x |
| Quick Ratio |
2.04x |
Dividend
| Rate |
547.00 JPY |
| Yield |
1.1% |
| Payout Ratio |
40.5% |
| Ex-Date |
2026-09-29 |
Analyst Consensus
| Target (Mean) |
83,130.00 JPY |
| Target (Median) |
80,100.00 JPY |
| Target (High) |
105,000.00 JPY |
| Target (Low) |
63,000.00 JPY |
| Recommendation |
buy |
| # Analysts |
20 |
Identifiers
| ISIN | JP3544370007 |
| FIGI | BBG000BKFJY7 |
| SEDOL | 6270803 |
Sentiment 72.0%
as of Sep 12, 2026
Positive drivers
Strong demand for Disco's precision dicing and grinding equipment driven by surging AI chip production from major foundries. Positive analyst upgrades and order backlog growth reported in late August 2026. Expansion into advanced packaging solutions aligning with next-gen AI hardware needs.
Neutral / mixed
Global semiconductor cycle showing mixed signals with some inventory adjustments among clients. Currency fluctuations impacting export revenues from Japan. Steady but not accelerating capex from key customers like TSMC and Samsung.
Negative drivers
Rising competition from domestic and international equipment makers pressuring margins. Geopolitical tensions affecting supply chains and potential export restrictions. Recent quarterly results slightly below expectations due to delayed shipments.
Bottom line
Overall sentiment remains moderately positive amid AI tailwinds, tempered by competitive and macroeconomic uncertainties. The 30-day window reflects cautious optimism for sustained growth in the AI semiconductor ecosystem.